Metallocene Polyolefin Based Low Activation Temperature Heat Seal Hot Melt Adhesive

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United States of America Patent

APP PUB NO 20160215176A1
SERIAL NO

15004312

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.0 pound per inch in order to meet the sealing performance requirements for packaging food and other consumer goods.

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Patent Owner(s)

Patent OwnerAddress
BOSTIK INC11320 WEST WATERTOWN PLANK ROAD WAUWATOSA WI 53226

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kanderski, Monina D Milwaukee, US 8 127
Vitrano, Michael D West Allis, US 10 45

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