HIGH IMPACT SOLDER TOUGHNESS ALLOY
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United States of America Patent
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Dec 28, 2015
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Aug 2, 2011
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Abstract
A lead-free solder alloy, comprising from 35 to 59% wt Bi; Cu in a concentration up to 1.0 wt %; from 0.01 to 0.5 wt % Ni; and the balance Sn, together with any unavoidable impurities, with certain embodiments further comprising Ag, such as up to 1 wt % Ag.
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