ELECTRICALLY INTERCONNECTING FOIL
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United States of America Patent
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Issued Date -
Jul 21, 2016
app pub date -
Sep 4, 2014
filing date -
Sep 4, 2013
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Abstract
The invention relates to a bendable electrically interconnecting foil for making flexible electronic circuits, more in particular circuits comprising rigid electronic components such as integrated circuits. The foil comprises a flexible substrate and stretchable conductive tracks for connecting the electronic components. Between the substrate and the tracks a resilient layer is situated. The invention further relates to an electronic circuit comprising the bendable electrically interconnecting foil.
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