SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20160211332A1
SERIAL NO

14911678

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Abstract

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A silicon carbide semiconductor device capable of achieving a high current gain with a simplified construction is provided. A silicon carbide layer includes a collector region, a base region, and an emitter region. The silicon carbide layer is provided with a trench having a sidewall surface reaching the base region from a first main surface through the emitter region. The sidewall surface includes a region macroscopically having an angle not smaller than 50° and not greater than 70° with respect to a {000-1} plane. A manufacturing method includes the step of forming a trench. The step of forming a trench includes the step of chemically treating the first main surface of the silicon carbide layer for forming the region.

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Patent Owner(s)

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SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiyoshi, Toru Osaka-shi, JP 122 647
Masuda, Takeyoshi Osaka-shi, JP 168 907

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