SEMICONDUCTOR SUBSTRATE ARRANGEMENT, A SEMICONDUCTOR DEVICE, AND A METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE

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United States of America Patent

APP PUB NO 20160211250A1
SERIAL NO

14597342

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Abstract

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According to various embodiments, a semiconductor substrate arrangement may be provided, wherein the semiconductor substrate arrangement may include: a semiconductor substrate defining a first area at a first level and a second area next to the first area at a second level, wherein the first level is lower than the second level; a plurality of planar non-volatile memory structures disposed over the semiconductor substrate in the first area; and a plurality of planar transistor structures disposed over the semiconductor substrate in the second area.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGCAMPBELL 1-15 NAUBIBERG GERMANY NEUBIBERG BAVARIA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BUKETHAL, Christoph Dresden, DE 5 51
GRATZ, Achim Dresden, DE 25 149
HATZOPOULOS, Nikolaos Dresden, DE 2 15
KNOBLOCH, Klaus Dresden, DE 11 70
LANGHEINRICH, Wolfram Dresden, DE 16 138
ROEHRICH, Mayk Dresden, DE 14 71
STAHRENBERG, Knut Dresden, DE 14 113
STRENZ, Robert Radebeul, DE 21 143
TEMPEL, Georg Dresden, DE 57 579

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