SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Jul 21, 2016
app pub date -
Mar 30, 2015
filing date -
Mar 30, 2015
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Abstract
A semiconductor structure and a method for fabricating the semiconductor structure are provided. The semiconductor structure includes a substrate, a plurality of composite layers, and at least one composite pillar. The substrate includes a first region and a second region. The composite layers are disposed on the substrate. Each of the composite layers includes at least one exposed surface and at least one sidewall. At least one staircase structure is formed by the exposed surface and the sidewall. The composite pillar is disposed on the exposed surface of the substrate.
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