PRESSURE SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20160209286A1
SERIAL NO

14987663

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pressure sensor module capable of fixing a diaphragm to a base body without using welding is provided. A base body, a first diaphragm, a first elastic body, and a first mounting member are included. The base body has a first recess with a pressure sensor element to be installed inside, and a first receiving surface section extending outward from an opening edge of the first recess. The first diaphragm is provided facing the first receiving surface section so as to close the first recess from an inlet side and arranged separably from the base body. The first elastic body is arranged on one surface side of the first diaphragm outside the opening edge of the first recess. The first mounting member is mounted on the base body with the first diaphragm and the first elastic body pressed toward the first receiving surface section.

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Patent Owner(s)

Patent OwnerAddress
TGK CO LTDTOKYO 193-0942

International Classification(s)

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  • 2016 Application Filing Year
  • G01L Class
  • 1354 Applications Filed
  • 1037 Patents Issued To-Date
  • 76.59 % Issued To-Date

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kaneko, Yasuaki Tokyo, JP 5 178
Oota, Masaki Tokyo, JP 4 4
Tsuda, Hitoshi Tokyo, JP 10 39

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  • 2 Citation Count
  • G01L Class
  • 15.57 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges903966119812101 - 1011 - 2021 - 3031 - 4051 - 6061 - 7091 - 1000255075100125150175200225250275300325350375400425

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