HEAT-DISSIPATING STRUCTURE
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United States of America Patent
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Issued Date -
Jul 21, 2016
app pub date -
Mar 13, 2015
filing date -
Mar 13, 2015
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Abstract
A heat-dissipating structure includes a heat-dissipating partition, a first heat-dissipating layer, and a second heat-dissipating layer. The heat-dissipating partition a first surface and a second surface that are opposite to each other. The first heat-dissipating layer includes a plurality of first heat pipes, each of which is disposed on the first surface of the heat-dissipating partition. The second heat-dissipating layer includes a plurality of second heat pipes, each of which is disposed on the second surface of the heat-dissipating partition. Each of the first heat pipes of the first heat-dissipating layer has at least one part overlapping at least one part of one of the second heat pipe of the second heat-dissipating layer. Thereby, heat from a to-be-cooled article can be quickly dissipated through the first heat-dissipating layer, the heat-dissipating partition, and the second heat-dissipating layer.
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