Substrate Etch
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United States of America Patent
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Issued Date -
Jul 21, 2016
app pub date -
Aug 30, 2013
filing date -
Aug 30, 2013
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Abstract
An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.
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