Electrodeposition method for preparing polycrystalline copper having improved mechanical and physical properties
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United States of America Patent
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Aug 28, 2018
Grant Date -
Jul 21, 2016
app pub date -
Jan 21, 2016
filing date -
Dec 18, 2007
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Abstract
Polycrystalline materials are prepared by electrodeposition of a precursor material that is subsequently heat-treated to induce at least a threefold increase in the grain size of the material to yield a relatively high fraction of ‘special’ low Σ grain boundaries and a randomized crystallographic texture. The precursor metallic material has sufficient purity and a fine-grained microstructure (e.g., an average grain size of 4 nm to 5 μm). The resulting metallic material is suited to the fabrication of articles requiring high mechanical or physical isotropy and/or resistance to grain boundary-mediated deformation or degradation mechanisms.
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