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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
CITIBANK N A	388 GREENWICH STREET 17TH FLOOR NEW YORK NY 10013

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• B22F:WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES F....
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
• C22C:ALLOYS

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Boureghda, Monnir	East Stroudsburg, US	11	71
Khaselev, Oscar	Monmouth Junction, US	35	189
Marczi, Michael T	Chester, US	22	170
Mo, Bin	East Brunswick, US	18	85
Singh, Bawa	Marlton, US	108	1502

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jan 14, 2028
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jan 14, 2032

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
July 14, 2020	US,10710336,B2   US10710336B2	GRANTED PATENT AS SECOND PUBLICATION
July 21, 2016	US,20160207286,A1   US20160207286A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 2016/0207,286

COMPOSITE AND MULTILAYERED SILVER FILMS FOR JOINING ELECTRICAL AND MECHANICAL COMPONENTS

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