Devices for and methods of forming microchannels or microfluidic reservoirs
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United States of America Patent
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Jan 26, 2021
Grant Date -
Jul 21, 2016
app pub date -
Sep 10, 2014
filing date -
Sep 20, 2013
priority date (Note) -
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Abstract
A method for forming a microchannel or microfluidic reservoir is described. Methods provided herein include applying a covering over a recess formed in a substrate and bonding the covering to the substrate along seams. Methods provided herein use a substrate having elevated edge regions bordering the recess that project from the surface of the substrate. Bonding seams nm a distance from the elevated edge regions of the recess such that the covering and the elevated edge regions are pressed against each other. Devices for bonding substrates and coverings to make microchannels and microfluidic reservoirs are also provided herein. Devices provided herein can include pressing elements for holding the substrate and the covering together. Pressing elements provided herein can include recesses and/or elastic layers positioned opposite to one or more recesses in a substrate.
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