Conductive Lines with Protective Sidewalls
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United States of America Patent
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Issued Date -
Jul 14, 2016
app pub date -
Jan 9, 2015
filing date -
Jan 9, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Trenches are formed partially through a sacrificial layer at locations where bit lines are to be formed with some sacrificial material overlying vias. The trenches are lined with a protective layer and then the trenches are extended to expose vias. Bit lines are formed. Then sacrificial material is removed from between bit lines while portions of the protective layer remain to protect the bit lines.
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