METHOD OF FORMING ASPER-SILVER ON A LEAD FRAME
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United States of America Patent
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Jul 14, 2016
app pub date -
Jan 8, 2015
filing date -
Jan 8, 2015
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Abstract
A method for plating a lead frame comprises the steps of plating the lead frame with at least one plating layer including silver and forming an asper-silver layer comprising nano-silver formations over the at least one plating layer including silver. The asper-silver layer is particularly beneficial for enhancing the adhesion of plastic molding compound to the lead frame.
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