Die and Manufacturing Method for a Die
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United States of America Patent
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Issued Date -
Jul 7, 2016
app pub date -
Jul 24, 2014
filing date -
Jul 24, 2014
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Abstract
The present invention refers to a die (1) with an improved crack detecting structure for a predefined area of the die comprising an electrical conductive path (5,6) laid along a perimeter of the predefined area and a first bond pad (17a) at the first end of the path (5, 6) and a second bond pad (17b) at the second end of the path (5, 6), wherein the electrical conductive path (5,6) contains at least one first path section (12) disposed at the front side of the die (1) and at least one second path section (13) disposed at the back side of the die (1), wherein the at least one first path section (12) and the at least one second path section (13) are coupled by at least one through connection (14). Further, the invention refers to a respective system on package and methods for manufacturing a respective die or a respective system on package.
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