Method of Fabricating an Electronic Device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160197025A1
SERIAL NO

14652532

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A silicone composition contains I) a shrink additive and II) a curable polyorganosiloxane composition. A method for fabricating an electronic device includes the steps of: 1) interposing the silicone composition between an IHS and a substrate, 2) curing the curable polyorganosiloxane composition to form a cured silicone product, and 3) removing the shrink additive during and/or after step 2), thereby compressing the IHS to the substrate. Compressing occurs as thickness of the cured silicone product decreases, as compared to thickness of the silicone composition interposed in step 1).

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Patent Owner(s)

Patent OwnerAddress
DOW CORNING CORPORATION2200 WEST SALZBURG ROAD MIDLAND MI 48686-0994

International Classification(s)

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  • 2013 Application Filing Year
  • H01L Class
  • 22267 Applications Filed
  • 20713 Patents Issued To-Date
  • 93.03 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2013201420152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhagwagar, Dorab Edul Saginaw, US 12 344
Larson, Lyndon Bay City, US 1 10
Steinbrecher, Kristen Midland, US 4 55
Tonge, James Sanford, US 23 282

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Patent Citation Ranking

  • 10 Citation Count
  • H01L Class
  • 13.47 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1792827316886303131891006776342711301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000

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