HEADPHONES HAVING AN ATTACHED SOUND MODULE
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United States of America Patent
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Issued Date -
Jul 7, 2016
app pub date -
Jan 2, 2015
filing date -
Jan 2, 2015
priority date (Note) -
Abandoned
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Abstract
Provided is a headphone system, comprising a sound module and a headphone body. The sound module comprises a module attachment interface, a module audio interface, and a controller. The headphone body comprises a first earphone; a second earphone; and a headphone attachment interface to provide removable attachment with the module attachment interface a headphone audio interface to couple with the module audio interface when the module attachment interface is engaged with the headphone attachment interface. The headphone audio interface communicates audio signals from the sound module to the first earphone and the second earphone when the module attachment interface is engaged with the headphone attachment interface. The controller transmits audio signals from the sound module to the module audio interface to further transmit to the headphone audio interface which transmits to at least one of the first and second earphones via the headphone audio interface.
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