COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL
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United States of America Patent
Stats
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N/A
Issued Date -
Jul 7, 2016
app pub date -
Jun 28, 2013
filing date -
Dec 28, 2012
priority date (Note) -
Published
status (Latency Note)
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Abstract
A copper alloy for an electric and electronic device comprises more than 2 mass % and less than 23 mass % of Zn; 0.1 mass % to 0.9 mass % of Sn; 0.05 mass % to less than 1.0 mass % of Ni; 0.001 mass % to less than 0.10 mass % of Fe; 0.005 mass % to 0.1 mass % of P; and a balance including Cu and unavoidable impurities, in which 0.002≦Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.3
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MITSUBISHI MATERIALS CORPORATION | 2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 100-8117 | |
MITSUBISHI SHINDOH CO LTD | KITA-SHINAGAWA SHINAGAWA-KU TOKYO |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
MAKI, Kazunari | Saitama-shi, JP | 74 | 205 |
# of filed Patents : 74 Total Citations : 205 | |||
MORI, Hiroyuki | Tsukuba-shi, JP | 401 | 3349 |
# of filed Patents : 401 Total Citations : 3349 | |||
YAMASHITA, Daiki | Osaka, JP | 35 | 428 |
# of filed Patents : 35 Total Citations : 428 |
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- H01B Class
- 0 % this patent is cited more than
- 9 Age
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