SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Jun 30, 2016
app pub date -
Dec 24, 2014
filing date -
Dec 24, 2014
priority date (Note) -
Abandoned
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Abstract
Provided is a semiconductor device and a method of manufacturing the same. The semiconductor device includes a plurality of stacked structures and a dielectric layer. The stacked structures are disposed on a substrate. The dielectric layer is disposed on the substrate, and covers the stacked structures. An air gap is located between two adjacent stacked structures, and a top end of the air gap is higher than a top end of each of the stacked structures.
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