DOPING METHOD AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD

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United States of America Patent

APP PUB NO 20160189963A1
SERIAL NO

14976456

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Abstract

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Disclosed is a method of performing doping by implanting a dopant to a processing target substrate. First, in an oxide film forming step, an oxide film is formed on the processing target substrate prior to performing a doping treatment. In addition, after the oxide film is formed on the processing target substrate, a plasma doping treatment is performed from a top of the oxide film after the oxide film forming step.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KOBAYASHI, Yuuki Miyagi, JP 23 163
OKA, Masahiro Yamanashi, JP 76 498
SUGIMOTO, Yasuhiro Yamanashi, JP 65 1060
UEDA, Hirokazu Yamanashi, JP 64 408

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