COPPER ALLOY AND COPPER ALLOY SHEET
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United States of America Patent
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app pub date -
Mar 10, 2016
filing date -
Sep 26, 2013
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Abstract
Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17≦f1=[Zn]+5×[Sn]−2×[Ni]≦30, 14≦f2=[Zn]−0.5×[Sn]−3×[Ni]≦26, 8≦f3={f1×(32−f1)}1/2×[Ni]≦23, 1.3≦[Ni]+[Sn]≦2.4, 1.5≦[Ni]/[Sn]≦5.5, and 20≦[Ni]/[P]≦400 are satisfied. The copper alloy has a metallographic structure of an α single phase.
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Patent Citation Ranking
- 4 Citation Count
- B22D Class
- 34.18 % this patent is cited more than
- 9 Age