LIQUID UNDERFILL MATERIAL COMPOSITION FOR SEALING SEMICONDUCTOR AND FLIP-CHIP SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Jun 30, 2016
app pub date -
Dec 18, 2015
filing date -
Dec 25, 2014
priority date (Note) -
Abandoned
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Abstract
Provided is a liquid underfill material composition which has a favorable curing property without adding a curing catalyst; a favorable thin film penetration ability derived from its low viscosity; a favorable adhesiveness; and a high heat resistance property. The liquid underfill material composition for sealing a semiconductor contains specific amounts of:
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