LIQUID UNDERFILL MATERIAL COMPOSITION FOR SEALING SEMICONDUCTOR AND FLIP-CHIP SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20160186024A1
SERIAL NO

14974073

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a liquid underfill material composition which has a favorable curing property without adding a curing catalyst; a favorable thin film penetration ability derived from its low viscosity; a favorable adhesiveness; and a high heat resistance property. The liquid underfill material composition for sealing a semiconductor contains specific amounts of:

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU CHEMICAL CO LTD28-1 NISHIFUKUSHIMA KUBIKI-KU KUBIKI-KU JOETSU-SHI NIIGATA 942-8601

International Classification(s)

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  • 2015 Application Filing Year
  • C09J Class
  • 1204 Applications Filed
  • 830 Patents Issued To-Date
  • 68.94 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KUSHIHARA, Naoyuki Annaka-shi, JP 36 37
SUMITA, Kazuaki Annaka-shi, JP 66 300

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Patent Citation Ranking

  • 2 Citation Count
  • C09J Class
  • 25.51 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges50126145101 - 1011 - 2021 - 3061 - 700102030405060708090100110120130140

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