CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL
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United States of America Patent
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Issued Date -
Jun 30, 2016
app pub date -
Dec 30, 2014
filing date -
Dec 30, 2014
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Abstract
The present disclosure is directed to a solder wire that includes a core having both a rosin flux and a thermoset material. The solder wire being configured to provide an oxide removing rosin flux to an electrical component, a solder alloy to the electrical component, and a protective layer to the solder alloy in a single soldering step.
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