HYDROGEN-RELEASING FILM

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United States of America Patent

APP PUB NO 20160181583A1
SERIAL NO

14910373

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The purpose of the present invention is to provide a hydrogen-releasing film and a hydrogen-releasing laminated film which are less susceptible to embrittling at an ambient operating temperature of an electrochemical element. This hydrogen-releasing film is characterized by containing a Pd—Cu alloy, and the Cu content in the Pd—Cu alloy being at least 30 mol %.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATION1-1-2 SHIMOHOZUMI IBARAKI-SHI OSAKA 567-8680
NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY1 FURO-CHO CHIKUSA-KU NAGOYA-SHI AICHI 4648601
INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY JAPANTOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUKUOKA, Takahiro Ibaraki-shi, JP 94 531
HATA, Kenta Ibaraki-shi, JP 5 5
ISHII, Kyoko Ibaraki-shi, JP 29 251
KIRA, Yoshiko Ibaraki-shi, JP 20 18
NANBU, Tomonori Suzuka-shi, JP 6 6
YUKAWA, Hiroshi Nagoya-shi, JP 14 64

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