METHOD FOR FABRICATING A TRANSISTOR WITH A RAISED SOURCE-DRAIN STRUCTURE

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United States of America Patent

APP PUB NO 20160181382A1
SERIAL NO

14577656

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Abstract

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A method for forming a transistor includes defining agate structure on a top surface of a first semiconductor layer of a silicon-on-insulator (SOI) substrate. The gate structure includes an insulating cover. A second semiconductor layer is then conformally deposited. The deposited second semiconductor layer includes an epitaxial portion on surfaces of the first semiconductor layer and an amorphous portion on surfaces of the insulating cover. The amorphous portion is then removed using a selective etch. The remaining epitaxial portion forms faceted raised source-drain structures on either side of the transistor gate structure. A slope of the sloped surface for the facet is dependent on the process parameters used during the conformal deposition.

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Patent Owner(s)

Patent OwnerAddress
STMICROELECTRONICS (CROLLES 2) SAS850 RUE JEAN MONNET CROLLES 38920
STMICROELECTRONICS SA29 BOULEVARD ROMAIN ROLLAND MONTROUGE 92120

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barge, David Grenoble, FR 8 9
Dutartre, Didier Meylan, FR 61 801

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