Single Solution for Electro-Electroless Deposition of Metals

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United States of America Patent

APP PUB NO 20160177455A1
SERIAL NO

14909552

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Abstract

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A hybrid electro-electroless deposition process whereby multiple metal films layers are deposited from a single plating solution which includes both electroless and electroplating components. The article to be plated is immersed in the solution, and electric current is selectively applied at determined voltages for predetermined times, at selected intervals to effect electroplating in conjunction with electroless deposition. Electroplated metal layers are interspersed with electroless deposited metal layers.

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Patent Owner(s)

Patent OwnerAddress
UNIVERSITY OF WINDSOR401 SUNSET AVENUE DEPT OF ELECTRICAL & COMPUTER ENGINEERING WINDSOR N9B 3P4

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
PETRO, Robert Windsor, CA 1 0
SCHLESINGER, Mordechay Windsor, CA 13 432

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