Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device
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United States of America Patent
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Aug 29, 2017
Issued Date -
N/A
app pub date -
Jun 26, 2014
filing date -
Jun 27, 2013
priority date (Note) -
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Abstract
A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 μm and less than 1 μm, not less than 1 μm and less than 10 μm, from 10 μm to 50 μm, and from 20 μm to 100 μm, and in which a peak present in a range of from 10 μm to 50 μm includes an aluminum oxide particle, and a peak present in a range of from 20 μm to 100 μm includes a boron nitride particle. In Formula (I) each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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