Shielded RF Transmission Lines in Low Temperature Co-fired Ceramic Constructs and Method of Making Same
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United States of America Patent
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Issued Date -
Jun 16, 2016
app pub date -
Dec 2, 2015
filing date -
Dec 15, 2014
priority date (Note) -
Abandoned
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Abstract
An integrated circuit assembly which includes stacked printed ceramic substrate layers, and incorporates a shielding enclosure extending about the electrical conductor traces and interconnects which form the assembly circuitry. The shielding enclosure is configured to reduce electric and/or magnetic field leakage or interference with the traces and interconnects. The enclosure is provided as a cage about the assembly circuitry, and which is formed as arrays of ground conductors in electrical communication with ground plates.
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