SYSTEM AND METHOD FOR ELECTROPLATING OF HOLE SURFACES
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United States of America Patent
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app pub date -
Feb 22, 2016
filing date -
Jan 9, 2014
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Abstract
An electroplating method for plating internal surfaces of holes in metal products uses a needle anode associated with an XYZ or multi-direction positioning device to position the needle such that an insertion portion of the needle anode is centered over a hole and inserted to a predetermined depth in the hole, with a discharge end located a predetermined distance from the inner end of the hole. Plating solution is supplied to the needle anode and flows continuously during plating from the discharge end of the needle, through a gap between the needle anode and inner surface of the hole, and out of the open end of the hole into a drain. In one example, the metal object is a terminal of an electrical connector and the hole is a solder cup at a terminal end of the connector.
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