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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ZTE CORPORATION	SHENZHEN

International Classification(s)

• H04L:TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAP....
• H04B:TRANSMISSION

• 2013 Application Filing Year
• H04L Class
• 23397 Applications Filed
• 19833 Patents Issued To-Date
• 84.77 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
GUO, Yang	Shenzhen City, Guangdong Province, CN	122	1205
# of filed Patents : 122 Total Citations : 1205
YU, Zhong	Shenzhen City, Guangdong Province, CN	24	215
# of filed Patents : 24 Total Citations : 215

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11.5 Year Payment	$7400.00	$3700.00	$1850.00	Dec 16, 2027

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Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2018/0033,745

SEMICONDUCTOR DEVICE HAVING A DUAL MATERIAL REDISTRIBUTION LINE AND METHOD OF FORMING THE SAME

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Abstract

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A semiconductor device includes a first passivation layer over an interconnect structure. The semiconductor device further includes a first redistribution line (RDL) via extending through an opening in the first passivation layer to electrically connect to the interconnect structure. The first RDL via includes a first conductive material. The semiconductor device further includes an RDL over the first passivation layer and electrically connected to the first RDL via. The RDL comprises a second conductive material different from the first conductive material. The RDL extends beyond the first RDL via in a direction parallel to a top surface of the first passivation layer.

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Description

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