Electronic module
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United States of America Patent
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Feb 9, 2021
Grant Date -
Jun 16, 2016
app pub date -
Apr 24, 2015
filing date -
Dec 10, 2014
priority date (Note) -
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Abstract
An electronic module is provided, which includes: a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body. A portion of the antenna body is exposed from the encapsulant. As such, the invention increases the arrangement area of the antenna body without increasing the size of the substrate, and also reduces the height of the encapsulant. Therefore, the electronic module of the present invention meets the miniaturization requirement.
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