SUBSTRATE WITH A SUPPORTING PLATE AND FABRICATION METHOD THEREOF

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United States of America Patent

SERIAL NO

14967986

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Abstract

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A method for forming a substrate with a supporting plate includes forming a substrate including an active area and an edge area. The active area is surrounded by the edge area. The method further includes forming the supporting plate with a shape corresponding to the shape of the edge area of the substrate. The supporting plate has a bonding surface to bond the substrate. Finally, the method includes attaching the supporting plate to the substrate with the bonding surface of the supporting plate bonded to the edge area of the substrate.

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Patent Owner(s)

Patent OwnerAddress
TONGFU MICROELECTRONICS CO LTD226004 NO 288 CHONGCHUAN ROAD NANTONG CITY JIANGSU PROVINCE NANTONG CITY JIANGSU PROVINCE 226004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zhu, Haiqing Nantong, CN 4 13

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