PACKAGE FOR A SURFACE-MOUNT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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app pub date -
Aug 31, 2015
filing date -
Dec 10, 2014
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Abandoned
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Abstract
A surface-mount electronic device includes a body of semiconductor material, a lead frame, which forms a plurality of contact terminals, and a package dielectric region, which overlies the semiconductor body. Each contact terminal includes an inner portion that is overlaid by the package dielectric region and an outer portion, which projects laterally beyond the package dielectric region and is delimited by a first lateral surface. The device further includes, for each contact terminal, an anti-oxidation layer, which is disposed on the corresponding first lateral surface.
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