HEATSPREADER WITH EXTENDED SURFACE FOR HEAT TRANSFER THROUGH A SEALED CHASSIS WALL
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United States of America Patent
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Issued Date -
Jun 16, 2016
app pub date -
Jul 29, 2013
filing date -
Jul 29, 2013
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Abstract
A system for cooling electronic components. The system includes tubing having a central portion attachable to a heat source disposed within a sealed enclosure. Distal portions of the tubing extend outside the enclosure through walls thereof. The system also includes fins attachable to the distal portions.
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