Copper film with large grains, copper clad laminate having the same and manufacturing method of copper clad laminate
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United States of America Patent
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Jun 12, 2018
Issued Date -
Jun 16, 2016
app pub date -
Nov 23, 2015
filing date -
Dec 11, 2014
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Abstract
The present invention provides a copper film with large grains, where, at least one surface, more than 50% area of the copper film is [100]-oriented grains, and the average size of [100]-oriented grains is more than 150 μm. The grains on the copper film have large grain sizes and high preferred orientation, so that the copper film is provided with excellent properties such as flexibility, stability and electro-migration resistance. A copper foil laminate with the above-mentioned copper film is also herein provided.
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