Thermoelectric Device Fabrication Using Direct Bonding
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United States of America Patent
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Issued Date -
Jun 9, 2016
app pub date -
Mar 12, 2014
filing date -
Mar 12, 2014
priority date (Note) -
Abandoned
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Abstract
Methods of fabricating a thermoelectric element include bonding at least one thermoelectric material leg to at least one of a header and an electrical connector using a direct bonding process. The direct bonding process may include liquid diffusion (e.g., brazing) or solid state diffusion bonding. The thermoelectric material leg may be directly bonded to the header or electrical connector without the use of a metal contact layer between the thermoelectric material leg and the header or electrical connector.
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