SEMICONDUCTOR DEVICE AND METHOD OF MAKING INCLUDING CAP LAYER AND NITRIDE SEMICONDUCTOR LAYER
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United States of America Patent
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app pub date -
Feb 18, 2016
filing date -
Sep 28, 2012
priority date (Note) -
Abandoned
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Abstract
To enhance the reliability of the semiconductor device using a nitride semiconductor. A channel layer is formed over a substrate, a barrier layer is formed over the channel layer, a cap layer is formed over the barrier layer, and a gate electrode is formed over the cap layer. In addition, a nitride semiconductor layer is formed in a region where the cap layer over the barrier layer is not formed, and a source electrode and a drain electrode are formed over the nitride semiconductor layer. The cap layer is a p-type semiconductor layer, and the nitride semiconductor layer includes the same type of material as the cap layer and is in an intrinsic state or an n-type state.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
RENESAS ELECTRONICS CORPORATION | TOKYO JAPAN |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
ISHIKURA, Kohji | Kanagawa, JP | 8 | 52 |
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