SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

SERIAL NO

14903424

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Abstract

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A semiconductor layer having an upper surface and an end surface intersecting with the upper surface, an upper electrode (source electrode) formed on the upper surface and electrically connected to the semiconductor layer, and a protecting film extending from over at least a portion of the upper surface to over at least a portion of the end surface are provided.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakai, Mitsuhiko Osaka-shi, JP 40 350

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