PACKAGE STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Jun 9, 2016
app pub date -
Dec 9, 2014
filing date -
Dec 9, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A package structure includes a chip, a substrate, wires and a molding compound. The chip includes an active surface, a back surface opposite to the active surface and bonding pads disposed on the active surface. The substrate includes a first solder mask, a first patterned circuit layer and a core layer having a first surface and a second surface opposite to the first surface. The first patterned circuit layer is disposed on the first surface. The first solder mask disposed on the first surface partially exposes the first patterned circuit layer. The substrate disposed on the active surface with the second surface exposes the bonding pads. The wires are connected between the first patterned circuit layer and the bonding pads. The molding compound covers the chip, the wire and the substrate. A top surface of the molding compound is coplanar with a top surface of the first solder mask.
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