PACKAGING-BEFORE-ETCHING FLIP CHIP 3D SYSTEM-LEVEL METAL CIRCUIT BOARD STRUCTURE AND TECHNIQUE THEREOF
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United States of America Patent
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Issued Date -
Jun 9, 2016
app pub date -
Dec 3, 2013
filing date -
Aug 6, 2013
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Abstract
Provided are a packaging-before-etching flip chip 3D system-level metal circuit board structure and technique thereof. The metal circuit board structure comprises a metal substrate frame; the front face of the metal substrate frame is provided with pins; the front faces of the pins are provided with conductive posts; chips are installed in a flip manner between the pins via underfills; the peripheral areas of the pins, the conductive posts and the chip are encapsulated with molding compound, the top of the molding compound being parallel to the tops of the conductive posts; and the surfaces of the metal substrate frame, the pins and the conductive posts exposing out of the molding compounds are provided with an anti-oxidation layer, thus solving the problem of limited functionality and application of a traditional metal lead frame due to the fact that objects cannot be embedded therein.
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