Polymer-based microfabricated thermal ground plane
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United States of America Patent
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Mar 20, 2018
Issued Date -
N/A
app pub date -
Oct 28, 2015
filing date -
Sep 15, 2014
priority date (Note) -
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Abstract
Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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International Classification(s)
- B23P:OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVE....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- F28D:HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTH....
- F28F:DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATU....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
- B44C:PRODUCING DECORATIVE EFFECTS
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