Method for hermetically sealing with reduced stress

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United States of America Patent

PATENT NO 9850122
SERIAL NO

14903709

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Abstract

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An electronic device comprising a first substrate having a device area, a first sealing element comprising an anelastic material and a second sealing element being a metal. The first sealing means and the second sealing means are arranged such that the inner side or the outer side of the sealing is completely formed by the second sealing element providing hermiticity and the other side is substantially formed by the first sealing element providing a flexible sealing.

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Patent Owner(s)

Patent OwnerAddress
MELEXIS TECHNOLOGIES NVTRANSPORTSTRAAT 1 POORT WEST-LIMBURG 1371-1372 TESSENDERLO 3980

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Van, Der Wiel Appolonius Jacobus Duisburg, BE 33 128

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