HEAT DISSIPATOR AND ASSOCIATED THERMAL MANAGEMENT CIRCUIT
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United States of America Patent
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Issued Date -
Jun 9, 2016
app pub date -
May 15, 2014
filing date -
May 15, 2014
priority date (Note) -
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Abstract
The present invention relates to a heat dissipator (7) for dissipating thermal energy contained in a first heat-transfer fluid and intended to be placed in a thermal management circuit (1) of a motor vehicle, said heat dissipator (7) comprising at least one inlet container (70) for the first heat-transfer fluid, at least one outlet container for the first heat-transfer fluid and heat-exchange surfaces (72) between the first heat-transfer fluid and a second heat-transfer fluid, at least one inlet container (70) and/or at least one outlet container for the first heat-transfer fluid comprising a phase change material (15).
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