FLIP-CHIP MEMS MICROPHONE
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United States of America Patent
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Issued Date -
Jun 2, 2016
app pub date -
Feb 13, 2015
filing date -
Nov 27, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A flip-chip MEMS microphone includes a substrate having a conduction line, a metal shell capped on the substrate to define therein a first cavity and having a sound receiving hole aimed at a sensor chip that is accommodated in the metal shell and electrically connected to a processor chip in the metal shell, and a plastic part mounted at one lateral side inside the metal shell and having built therein exposed ports that are electrically connected with the conduction line and the processor chip. Thus, the flip-chip MEMS microphone provides a flip-chip package structure to increase the cavity volume, improving the signal-to-noise ratio (SNR).
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