SUBSTRATE PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Jan 27, 2016
filing date -
Jul 29, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for manufacturing a semiconductor device includes: supplying a remover to a substrate including a Si-containing film on which a denatured layer is formed in order to remove the denatured layer; supplying a processing gas containing two or more halogen elements to the substrate in order to remove the Si-containing film; and supplying the remover to the substrate after the act of removing the Si-containing film in order to remove a residue of the denatured layer left after the act of removing the Si-containing film.
First Claim
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