MODULAR HEAT SINK
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United States of America Patent
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Issued Date -
Jun 2, 2016
app pub date -
Jun 10, 2014
filing date -
Jun 26, 2013
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Abstract
A modular heat dissipation assembly (2) used for a light emitting device (100) is presented. It comprises a base (22), which comprises a first number of arrangements (23), for thermally coupling to a light source (31) of the light emitting device (100); and a second number of heat conducting elements (21) which are attached to the base (22) via the arrangements (23), and the second number varies from zero to a maximum equal to the first number, so that a thermal capacity of the modular heat dissipation assembly matches a predetermined thermal load of the light emitting device. In one aspect, configurations to maintain a chimney effect with the modular heat dissipation assembly are presented. A luminaire comprising such a heat dissipation assembly and the manufacturing method for the heat dissipation assembly are also presented.
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