RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR ENCAPSULATION METHOD USING SAME
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United States of America Patent
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Issued Date -
Jun 2, 2016
app pub date -
Dec 1, 2015
filing date -
Dec 1, 2015
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Abandoned
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Abstract
Provided are a resin composition for semiconductor encapsulation being fluid and exhibiting a low viscosity at a room temperature; and a semiconductor encapsulation method resulting in a small warpage even after performing molding through resin encapsulation i.e. a wafer level package-encapsulation method.
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