RESIN COMPOSITION AND LAMINATE FOR PRINTED CIRCUIT BOARD COMPRISING SAME

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United States of America Patent

APP PUB NO 20160150644A1
SERIAL NO

14441400

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure relates to a resin composition, which serves as an insulation layer of a laminate for a printed circuit board while exhibiting adhesiveness to a metal base layer, the resin composition including: a rubber-modified epoxy resin; an epoxy resin; an inorganic filler; and a curing agent.

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Patent Owner(s)

Patent OwnerAddress
DOOSAN CORPORATIONSEOUL 04563

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAN, Duk Sang Daejeon, KR 4 33
JUNG, Yoon Ho Yongin-si, KR 4 10
LEE, Hang Seok Uijeongbu-si, KR 1 1
YANG, Dong Bo Yongin-si, KR 3 7

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