COOLING DEVICE FOR ELECTRONIC COMPONENTS
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United States of America Patent
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app pub date -
Jan 30, 2016
filing date -
Dec 8, 2012
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Abandoned
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Abstract
A cooling device for electronic components is a combination of substrate (aluminum nitride substrate—thermoelectric elements—aluminum nitride substrate) and utilizing the temperature difference generated by two top and bottom ends of the cooling device to effectively remove the heat generated by the electronic components. This cooling device not only can effectively reduce temperature of the electronic components, but also store the power generated through its thermoelectric effect.
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