MICRO-ELELCTRO-MECHANICAL SYSTEM DEVICE AND METHOD FOR FABRICATING THE SAME

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United States of America Patent

APP PUB NO 20160145094A1
SERIAL NO

14741471

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Abstract

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A method for fabricating a micro-electro-mechanical system (MEMS) device includes following steps. A cap layer is formed on an MEMS structure. The MEMS structure has a plurality of sacrificial structures. The cap layer has a plurality of release holes. The release holes are located on the sacrificial structures. A dielectric layer is formed on the cap layer, and the dielectric layer fills the release holes. A planarization process is performed on the dielectric layer. The sacrificial structures are then removed to form at least one cavity in the MEMS structure.

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Patent Owner(s)

Patent OwnerAddress
UPI SEMICONDUCTOR CORP9F -1 NO 5 TAIYUAN 1ST ST ZHUBEI CITY HSINCHU COUNTY 302

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Li-Yeat Hsinchu County, TW 7 49
Lan, Yi-Chaio Hsinchu County, TW 1 2
Lee, Yueh-Kang Hsinchu County, TW 13 6

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